Blackstar is a wafer dicing system utilizing a basic zero width laser dicing technology (zwldt) invented and patented by fonon technology.
Wafers have the highest value at the dicing stage and the primary focus of a blackstar is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the haz specifically for power hungry rf micro devices and low-k wafer substrates.
System is applicable for dicing of assorted semiconductor materials such as silicon (si) , gallium arsenide (gaas) , germanium (ge) , indium phosphide (inp) , silicon carbide (sic) , gallium nitride (gan) , gallium phosphide (gap) , other compound materials, as well as low-k and multi-layer composite materials.
Blackstar is an alternative to mechanical saws too damaging and costly for cutting of thin silicon, low-k, and complex material wafers.
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