Zero Width Laser Cutting Technology
The GW500AB is the latest generation of precision ZWLCT Laser Glass Wafer Dicing system for IR and CF camera windows, micro displays and other demanding applications.
LASER
Type Fantom sealed CO2 Laser
Sealed system allows modular replacement
WAFER
Material: Glass 0.3 -0.5 mm thick.
Wafer size 12" max.
Frame: Standard types (5'', 6'', 8'' or 12")
Holding tape: standard low tack
VISION SYSTEM
Two-level Magnification
Optical zoom
Type: Pattern Recognition with Automatic Alignment
MOTION SYSTEM
4 axis direct drive servo platform.
Working area 800 x 800 mm
Maximum axis speed 2000 mm/s
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