Gap Pad thermal products are designed to improve an assembly's thermal
performance and reliability while saving time and money.
1) Eliminates air gaps to reduce thermal resistance
2) High conformability reduces interfacial resistance
3) Low-stress vibration dampening
4) Shock absorbing
5) Easy material handing
6) Puncture,shear and tear resistance
7) Improved performance for high-heat assemblies
8) Available in custom die-cut parts
Gap Pad products are well suited to a wide variety of electronics, automotive,
medical, aerospace and military applications such as:
1) Between an IC and a heat sink or chassis
2) Between a semiconductor and heat sink
3) CD-ROM/DVD cooling
4) Heat pipe assemblies
5) RDRAM memory modules
6) DDR SDRAM
7) Hard drive cooling
8) Power supply
9) Signal amplifiers
10) Between other heat-generating devices and chassis
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